• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for coating a substrate (26) with a lacquer, comprising the following steps: - the lacquer is uniformly applied to the substrate (26), - the solvent content of the lacquer (30) applied to the substrate (26) becomes reduced, - the coated substrate (26) is exposed to a solvent atmosphere. The invention further relates to a device for planarizing a lacquer layer.
    公开号:AT516292A2
    申请号:T50785/2015
    申请日:2015-09-15
    公开日:2016-04-15
    发明作者:
    申请人:Suss Microtec Lithography Gmbh；
    IPC主号:
    专利说明:

    The invention relates to a method for coating a substrate with a lacquer and to a device for planarizing a lacquer layer on a substrate.
    In micro- and nanofabrication processes, lacquers are usually used, which are applied to the substrate to be processed in one layer. With the help of these paints, for example, B. masks are produced on the substrates, with the help of which a desired structure can be produced on the substrate or processing can take place. For this purpose, for example, the paints are photosensitive, so that the desired structure can be transferred from a photomask to the photosensitive resist by means of optical imaging.
    For optimum results, it is extremely important that the applied paint layer be free of bumps and particles. In addition to rotation methods, spray methods are also used to apply the paint to the substrate, in which the paint is sprayed onto the substrate by means of a nozzle. Especially for substrates with topographies, i. Substrates, which themselves already have vertical, three-dimensional structures on their surface, can be achieved as effectively as possible by spraying the paint on a coating layer which is as homogeneous as possible.
    However, when spraying the paint, paint particles form on the paint layer because a certain number of paint drops dries during flight between the nozzle and substrate and then already impinges on the surface of the substrate or paint there as (almost) cured paint particles. These paint particles accumulate on the sprayed lacquer layer and lead to problems in further processing, for example during exposure, and finally to local defects in the structures produced.
    It is an object of the invention to provide a method and a device in which the paint layer applied to the substrate is flat and free of paint particles.
    The object is achieved by a method for coating a substrate with a lacquer, in which the lacquer is uniformly applied to the substrate, then the solvent content of the lacquer applied to the substrate is reduced and subsequently the coated substrate is exposed to a solvent atmosphere. By exposing the coated substrate to a solvent atmosphere, the paint particles that have formed on the substrate are dissolved. However, since the solvent content of the substrate has previously been reduced, it is ensured that the paint applied to the substrate does not continue to flow or flow again when treated in a solvent atmosphere. This ensures that the substrate remains completely covered with varnish, even on steep areas of an existing topography.
    The solvent content of the applied paint must be kept within a range in which the viscosity of the applied paint is sufficiently high so that the paint no longer flows while the substrate is exposed to the solvent atmosphere. At the same time, the solvent content must not have been reduced such that the paint particles or bumps can not be resolved by the solvent atmosphere.
    The term "paint" in this context means a mixture of a solvent and a suitable for the desired application paint.
    Preferably, after being exposed to the solvent atmosphere, the coated substrate is heated, whereby the applied paint is softbaked. The softbake reduces the solvent content of the paint to such an extent that the paint is completely solidified and processed, e.g. B. can be exposed.
    In order to reduce the solvent content of the paint applied to the substrate in the desired manner, the coated substrate may be exposed to a vacuum. In this way, a part of the volatile solvent evaporates, so that the viscosity of the varnish is increased.
    This is understood to mean a pressure of less than 0.3 bar under a vacuum.
    In one embodiment, the coated substrate is heated to reduce the solvent content of the paint applied to the substrate, thereby also increasing the viscosity of the paint.
    In one embodiment of the invention, the solvent atmosphere has a solvent content of at least 50 mol%, in particular at least 70 mol%. These values have been found to be particularly suitable for dissolving and thereby removing unevenness and paint particles on the applied paint.
    The solvent may be acetone or methyl ethyl ketone, whereby inexpensive and known solvents may be used.
    In one embodiment of the invention, the temperature of the solvent atmosphere is above the boiling temperature of the solvent, thereby preventing condensation of the solvent which can lead to undesirable solvent droplets. These
    Drops are undesirable because they can drip uncontrollably on the coated lacquer and destroy the lacquer layer.
    For example, the pressure of the solvent atmosphere is greater than or equal to 0.5 bar, in particular greater than or equal to 0.7 bar, whereby a reliable removal of the paint particles and the bumps is ensured.
    The coated substrate may be exposed to the solvent atmosphere for 480 seconds or less, more preferably 420 seconds or less. This time is long enough to dissolve paint particles and even out bumps, but short enough so that the applied paint does not redissolve and begin to flow.
    In one embodiment of the invention, the paint is applied evenly to the substrate by spraying, whereby the substrate can be uniformly coated in a proven manner, even when the substrate has topographies.
    The object is further achieved by a device for planarizing a lacquer layer on a substrate, with a treatment space, a drying device designed to reduce the solvent content of the lacquer layer, and an evaporator that can generate a solvent atmosphere in the treatment space. By the device it is possible to dry a lacquer layer, i. H. reduce the solvent content of the paint to the extent that it no longer flows. In addition, unevenness and paint particles on the paint layer can be removed by the solvent atmosphere.
    The term "evaporator" is not limited to devices that generate a gas from solids or liquids. The term also includes other devices capable of producing a solvent atmosphere in the treatment space, such as a gas reservoir with matching valve.
    Preferably, the device has a coating device which can apply the lacquer layer uniformly to the substrate, in particular can spray on it. As a result, a uniform lacquer layer can be produced on substrates in a proven manner, in particular also on substrates with topographies.
    For example, the drying apparatus has a vacuum pump and / or at least one Venturi nozzle, which can generate a vacuum in the treatment space, so that solvent evaporates from the applied lacquer layer and the proportion of solvent in the lacquer layer decreases.
    In one embodiment variant, the drying device is a heating device that can heat the lacquer layer so that the solvent content of the applied lacquer layer is likewise reduced.
    In one embodiment of the invention, the apparatus has a heating system which can heat the atmosphere in the treatment room, whereby the temperature of the atmosphere in the treatment room can be controlled. For example, this heating system can also heat the applied paint layer.
    In one embodiment of the invention, the evaporator produces a solvent atmosphere having a solvent content of at least 50 mole%, especially at least 70 mole%, thereby ensuring a solvent concentration in the atmosphere that is sufficiently high to level out unevenness and to dissolve paint particles.
    Further features and advantages of the invention will become apparent from the following description and from the accompanying drawings, to which reference is made. In the drawings show:
    FIG. 1 shows schematically a device according to the invention according to a first embodiment of the invention,
    Figure 2 shows schematically a device according to the invention according to a second embodiment of the invention, and
    Figures 3a to 3c schematically in section a substrate to be coated at different times of the method according to the invention.
    FIG. 1 schematically shows a device 10 which serves for coating and treating a substrate. For example, the substrate is a semiconductor, which is later processed.
    The device 10 has a treatment space 12 in which a substrate holder 14 is provided. The treatment room 12 is communicated with an evaporator 16 and a drying apparatus 18.
    In addition, the device 10 may be provided with a coating device 20.
    The apparatus 10 also includes a heating system 22 that is disposed in the treatment room 12 and that can heat the atmosphere within the treatment room 12.
    The heating system 22 may be formed in the treatment room 12 by, for example, heating rods or reversing.
    Coating device 20 in the embodiment shown has a nozzle 24 with which a substrate 26 arranged on substrate holder 14 can be uniformly sprayed with lacquer.
    In the first embodiment, the drying device 18 has a vacuum pump 28 that is fluidically connected to the treatment space 12 and that can evacuate it. For example, the vacuum pump 28 can reduce the pressure in the treatment space 12 to 0.2 bar.
    Furthermore, the drying device 18 may have at least one Venturi nozzle for evacuation of the treatment space 12.
    The evaporator 16 is configured such that it can generate a solvent atmosphere in the treatment space 12. For this purpose, it is also in fluid communication with the treatment room 12.
    The evaporator 16 may, for example, comprise a solvent-filled gas wash bottle through which a gas stream, in particular a stream of nitrogen, is passed, whereby the solvent evaporates. The vaporized solvent is then introduced into the treatment space 12 together with the nitrogen.
    Of course, other ways of providing a solvent atmosphere are conceivable, for example, the thermal or mechanical evaporation of solvent, or the use of a solvent reservoir in which a solvent is already in gaseous form.
    The solvent content of the solvent atmosphere generated by the evaporator 16 is at least 50 mol%, especially at least 70 mol%.
    The solvent is, for example, acetone or methyl ethyl ketone.
    The method performed by the apparatus for coating a substrate with a lacquer and planarizing the lacquer layer applied to the substrate 26 will now be described with reference to Figs. 3a to 3c.
    FIG. 3 a shows, in sections, a substrate 26 to be coated, schematically in cross-section. At the beginning of the process, the substrate 26 is uncoated and free from contamination.
    The illustrated substrate 26 is shown as planar for simplicity. However, the method of the invention can also be applied to substrates having vertical, three-dimensional topographies.
    With the aid of the coating device 20, the lacquer, which is a mixture of the lacquer suitable for the desired application and a solvent, is then applied uniformly to the substrate 26, for example by spraying.
    In FIG. 3b, the substrate 26 with applied lacquer layer 30 is shown.
    It can be seen that the paint has local irregularities 32 here. Also, paint particles 34 may have accumulated on the paint layer 30. These paint particles 34 may be formed, for example, by drying individual paint drops produced by the nozzle 24 during flight to the substrate 26 and forming hollow balls.
    Both the paint particles 34 and the bumps 32 are undesirable because they can affect the quality of the further nano or microfabrication process.
    To remove the unevenness 32 and paint particles 34, the paint applied to the substrate 26, ie the paint layer 30, is dried, as a result of which the proportion of solvent in the paint layer 30 is reduced.
    This can be done by evacuating the treatment space 12 by means of the vacuum pump 28 and / or Venturi nozzle. For example, a pressure of 0.2 bar can be generated in the treatment space 12. The coated substrate 26 is thus exposed to a vacuum.
    By the depression, parts of the solvent of the varnish evaporate, so that the solvent content of the varnish layer 30 is lowered. The lacquer layer 30 with the reduced solvent content now has an increased viscosity, so that the lacquer layer 30 can no longer flow.
    This is particularly important for substrates with topographies, as a too-liquid paint would flow into depressions and depressions of the substrate, so that higher-lying corners and edges would remain without a sufficient lacquer layer.
    Subsequently, by means of the evaporator 16, gaseous solvent, for example acetone or methyl ethyl ketone, is introduced into the treatment space 12, so that a solvent atmosphere is formed in the treatment space 12.
    It has been found to be particularly suitable to use a solvent content in the solvent atmosphere of at least 50 mol% and in particular at least 70 mol%.
    The pressure of the solvent atmosphere is preferably greater than or equal to 0.5 bar, in particular greater than or equal to 0.7 bar.
    If necessary, the treatment space 12 can be heated by means of the heating system 22 so that the temperature of the solvent atmosphere is raised, for example to a temperature above the boiling point of the solvent.
    The solvent atmosphere in the treatment space 12 acts on the paint layer for a few minutes. Particularly suitable is an exposure time of not more than 480 hours, more preferably not more than 420 seconds.
    In this case, the beginning or the end of the duration for which the substrate 26 is exposed to the solvent atmosphere may be defined by the solvent component of the solvent atmosphere exceeding or falling below a certain value, for example 50 mol% or 70 mol%.
    After the coated substrate 26 with the resist layer 30 has been exposed to the solvent atmosphere, the solvent atmosphere is removed from the treatment space 12. This is done, for example, by treating the treatment space 12 with an inert gas, e.g. Nitrogen, is rinsed. However, this step can also be done by means of the vacuum pump 28 and / or Venturi nozzle.
    As a result of the gaseous solvent in the solvent atmosphere, the unevennesses 32 have been leveled and the lacquer particles 34 have been dissolved on the lacquer layer 30, so that a homogeneous and planar surface of the lacquer layer 30 has now formed. The lacquer layer 30 is thus (almost) free of unevenness 32 and lacquer particles 34. The substrate 26 after exposure in the solvent atmosphere is shown in FIG. 3c.
    Now the coated substrate 26 can be heated with the lacquer layer 30, so that the lacquer layer 30 is subjected to a softbake.
    The coated substrate 26 with the lacquer layer 30 can then be further processed, for example, exposed.
    The pressure, temperature, and solvent content of the solvent atmosphere, as well as the duration the substrate is exposed to the solvent atmosphere, and others
    Parameters are exemplary and must be e.g. adapted to the solvent used and the varnish used to achieve optimum results.
    FIG. 2 shows a second embodiment of the device 10. It corresponds essentially to the first embodiment according to FIG. 1, so that identical and functionally identical parts are designated by the same reference numerals. In the following, only the differences will be discussed.
    The drying apparatus 18 of the apparatus 10 of the second embodiment has no vacuum pump but a heater 36.
    The heater 36 is provided in the substrate holder 14, for example, and may heat the substrate 26 and any resist layer 30 applied thereon.
    The method performed by means of the device 10 according to the second embodiment also substantially corresponds to the method already described. However, the solvent content of the paint applied on the substrate 26, that is, the paint layer 30, is otherwise reduced.
    The heater 36 heats the coated substrate 26 with the resist layer 30 so that the solvent in the resist layer 30 partially evaporates, thereby reducing the solvent content of the resist layer 30.
    In addition, the solvent atmosphere generated in the treatment room 12 can be removed from the treatment room 12 by means of a fan 40 provided in a ventilation duct between the treatment room 12 and the environment of the apparatus 10.
    Of course, the features of the embodiments shown may be combined as desired. For example, it is conceivable that the device 10 has both a heater 36 and a vacuum pump 28. This makes it possible to produce a very pure solvent atmosphere, since the treatment space 12 can be evacuated before the solvent atmosphere is introduced into the treatment space 12.
    It is also conceivable that the heating device 36 and the heating system 22 are formed by the same heating elements, so that with these heating elements both the treatment space 12 and thus the solvent atmosphere and the coated substrate 26 can be heated.
    权利要求:
    Claims (16)
    [1]
    Claims 1. A method of coating a substrate (26) with a lacquer comprising the steps of: - applying the lacquer uniformly to the substrate (26); - reducing the solvent content of the lacquer (30) applied to the substrate (26); the coated substrate (26) is exposed to a solvent atmosphere.
    [2]
    A method according to claim 1, characterized in that the coated substrate, after being exposed to the solvent atmosphere, is heated and thus the applied lacquer (30) is softbaked.
    [3]
    A method according to claim 1 or 2, characterized in that the coated substrate is subjected to a vacuum to reduce the solvent content of the paint (30) applied to the substrate (26).
    [4]
    A method according to any one of the preceding claims, characterized in that the coated substrate (26) is heated to reduce the solvent content of the paint (30) applied to the substrate (26).
    [5]
    5. The method according to any one of the preceding claims, characterized in that the solvent atmosphere has a solvent content of at least 50 mol%, in particular at least 70 mol%.
    [6]
    A process according to any one of the preceding claims, characterized in that the solvent of the solvent atmosphere is acetone or methyl ethyl ketone.
    [7]
    Process according to any one of the preceding claims, characterized in that the temperature of the solvent atmosphere is above the boiling point of the solvent.
    [8]
    8. The method according to any one of the preceding claims, characterized in that the pressure of the solvent atmosphere is greater than or equal to 0.5 bar, in particular greater than or equal to 0.7 bar.
    [9]
    A method according to any one of the preceding claims, characterized in that the coated substrate (26) is exposed to the solvent atmosphere for 480 seconds or less, more preferably 420 seconds or less.
    [10]
    10. The method according to any one of the preceding claims, characterized in that the paint is applied by spraying uniformly on the substrate.
    [11]
    An apparatus for planarizing a resist layer (30) on a substrate (26), comprising a treatment space (12), a drying device (18) adapted to reduce the solvent content of the resist layer (30), and an evaporator (16). which can generate a solvent atmosphere in the treatment space (12).
    [12]
    A device according to claim 11, characterized in that the device (10) comprises a coating device (20) capable of applying the paint evenly to the substrate, in particular of being able to spray it.
    [13]
    Device according to claim 11 or 12, characterized in that the drying device (18) comprises a vacuum pump (28) capable of generating a vacuum in the treatment space (12).
    [14]
    Device according to one of Claims 11 to 13, characterized in that the drying device (18) has a heating device (36) which can heat the lacquer layer (30).
    [15]
    Device according to any one of Claims 11 to 14, characterized in that the device (10) comprises a heating system (22) capable of heating the atmosphere in the treatment space (12).
    [16]
    Device according to any one of Claims 11 to 15, characterized in that the evaporator (16) produces a solvent atmosphere having a solvent content of at least 50 mol%, in particular at least 70 mol%.
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    法律状态:
    优先权:
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